| 3DeVOKÂ MQ Technical Specifications |
| Light Sources |
22 Infrared Laser Lines [Invisible] |
Infrared VCSEL Structured Light [Invisible] |
| Class of Lasers |
Class â… (Eye-safe) |
| Scan Modes |
Infrared Laser Lines
Supports markerless and invisible-light scanning |
Infrared Linear-array Structured Light (Speckle)
Supports markerless scanning, invisible-light scanning, partial fine scanning, and rapid scanning at ultra-long-distance range and ultra-large FoV |
| Accuracy✱ |
Up to 0.08 mm |
| Point Distance |
0.1-5 mm |
| Alignment Mode |
Support hybrid, markers, texture, and geometric features alignment |
Support hybrid, texture, and geometric features alignment |
| Ability to Capture Texture |
Yes |
| Scanning Distance |
150-1,000 mm |
150-1,500 mm |
| Field of View |
140 mm × 140 mm – 490 mm × 490 mm |
50 mm × 75 mm – 1,100mm × 1,000mm |
| Scanning Frame |
Up to 70 FPS (Marker alignment) |
Up to 30 FPS |
| Scanning Speed |
Up to 2,450,000 Points/s |
Up to 4,500,000 Points/s |
| Output Formats |
*.obj, *.stl, *.ply, *.asc, *.mk2, *.txt, *.epj, *.apj, *.spj, *.map, *.sk |
| The Ability for 3D Printing |
Supports .stl, .obj and other formats |
| Wireless Scanning |
Support (with an optional handle) |
| Working Temperature Range |
0 – 40 ℃ |
| Working Humidity Range |
10% – 90% RH (Non-condensing) |
| Interface |
USB 3.0 |
| Scanner Dimensions & Weight |
Dimensions: 215 mm × 73 mm × 53 mm; Weight: 550 g |
| Power Source |
DC: 12 V, 5.0 A |
| Certifications |
CE-EMC, FCC, RoHS, IEC 60825, IEC 62471, IEC 60529-IP50, WEEE, KC |
| Recommended Configurations for PC |
OS: Win10/Win11, 64-bit; CPU: i7-13650HX and above; RAM: 32GB and above;
Graphic Card: NVIDIA discrete graphics card, NVIDIA RTX3060 and above; Graphics memory: 6GB and above |
